The 13th MICROOPTICS CONFERENCE (MOC '07) will be held at Sunport Takamatsu, Takamatsu, Kagawa, Japan on October 28 - October 31, 2007. This conference is sponsored by The Japan Society of Applied Physics (JSAP) and organized by Microoptics Group, The Optical Society of Japan (OSJ), JSAP in cooperation with several academic societies and associations.

The MOC '07 is intended to provide a central forum for an update and review of scientific and technical information covering a wide range of microoptics field from fundamental researches to systems and applications.
 
 

A. Optical Communications
Photonic networks, Optical cross connects, LAN, VSR, SAN, FTTH, etc.

B. Optical Interconnects
Chip/Board/System, Data transfer, etc.

C. Optical Storages
Optical heads, Disks, Near-field recording, Holographic recording, Multi-layer recording, Super resolution, etc.

D. Optoelectronic Equipment
Printers, Image sensors, Digital cameras, Advanced microscopes, etc.

E. Optical Sensing and Processing
Image recognition, Physical measurements, Sensors and sensing systems, Security systems, Optical computing, etc.

F. Displays and Lighting
LCD, PDP, FED, EL, Micromirror, Laser and LED projectors, 3D displays, Solid state lighting, Illuminations, etc.

G. New Applications
Environmental and Energy optics, Bio- and Medical optics, Nano-photonics, Quantum systems, Next generation and Intelligent microoptics, Agricultural and Fishery optics, etc.

1. Theory, Modeling and Design
Aberrations, Dispersion, Beam optics, Guided-wave optics, Gradient-index optics, Diffractive optics, Photonic band, Slow light, Near-field optics, Nonlinear optics, Thermooptics, Plasmonics, Simulation and System design, etc.

2. Materials and Fabrication
MSemiconductors, Crystals, Dielectric materials, Polymers, Liquid crystals, Nonlinear materials, Composite materials, Nano-materials, Metals, Spin-materials, etc. Diffusion and Ion exchange, Lithography and Etching, Thin film deposition, Micro- and Nano-fabrication, Nano-imprint, Laser fabrication, etc.

3. Measurements
Spectroscopy, Interferometry, Reflectometry, Femto-second measurement, 3D measurement, Quantum measurement, etc.

4. Passive Devices
Fibers, Waveguides, Multi/Demultiplexers, Add-drop multiplexers, Branching and mixing components, Photonic crystals, Filters, Microlenses, Diffractive optical elements, Isolators, Polarizers, etc.

5. Dynamic and Functional Devices
MEMS, Switches, Modulators, Tunable devices, Wavelength converters, Nonlinear optical devices, Deflectors, Optical buffers, etc.

6. Active Devices
ILasers, LEDs, VCSELs, Array lasers, Amplifiers, Terahertz devices, Sensors, etc.

7. Integration and Packaging
Monolithic and Hybrid integration, Mounting and packaging, Micro-assembly, Si photonics, 3D integration, etc.

8. Conception for Applications
High power, High speed, High efficiency, High field, High Density, High sensitivity, etc.